 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| data sheet MQFP Features: LEADFRAME Metric Quad Flat Pack (MQFP) Packages: Amkor's MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material and processes to assure successful, reliable performance of your IC chips. Having a complete line of MQFPs available and at your disposal means security and convenience. Sourcing them from Amkor means success. Thermal Enhancement: Some designs and applications require an added margin of thermal performance (power). Amkor's easy and cost-effective solution is a heatspreader. This optional embedded thermal aid improves Theta JA by greater than 15% (without external heatsinks or fans) by increasing the heat dissipation path from the IC chip to the PCB. Applications: Amkor's MQFP line is adapted to meet the increasing challenges of advancing processors/controllers, DSP, ASIC, video-DAC, PC chip-sets, gate arrays, logic, multi-media and other technologies. These packages fill many end application needs in consumer, commercial, office, automotive, PC, industrial and other product areas. Amkor's MQFP IC package portfolio provides: * 10 x 10 mm to 40 x 40 mm body size * 44 to 304 lead counts * Hi-conductivity copper leadframes * Die up and down configurations * JEDEC standard compliant * Wide selection of leadframe die pad sizes * Integrated thermal enhancement * Heatspreader available * Custom leadframe design available * Fine pitch wire bond capability * Lead free option available Multi-Layer PCB Body Pkg Size (mm) 44 ld 10 x 10 64 ld 14 x 14 JEDEC Standard Test Boards Thermal Resistance: Pad Size 7.4 x 7.4 8.9 x 8.9 Theta JA (C/W) by Velocity (LFPM) 0 38.4 33.7 200 32.1 27.9 500 29.4 25.5 Multi-Layer PCB Body Pkg Size (mm) **44 ld 10 x 10 **64 ld 14 x 14 *100 ld 14 x 20 *208 ld 28 x 28 *240 ld 32 x 32 *304 ld 40 x 40 * Pre-JEDEC Standard Test Boards ** JEDEC Standard Test Boards Pad Size 7.4 x 7.4 8.9 x 8.9 11.0 x 11.0 11.0 x 11.0 12.7 x 12.7 11.0 x 11.0 Theta JA (C/W) by Velocity (LFPM) 0 37.5 32.7 27.3 25.7 24.5 26.8 200 31.8 27.4 23.5 22.6 21.8 24.0 500 29.4 25.1 21.6 20.9 20.5 22.5 Electrical: Pkg 44 ld Body Size (mm) Lead 10 x 10 Longest Shortest Inductance (nH) 1.660 1.460 Capacitance (pF) 0.322 0.342 Resistance (m) 19.8 17.0 Simulated Results @ 100 MHz Reliability: Amkor's MQFPs are reliability assured through optimized design, material and process enabling high performance operation of your IC chip. * Moisture Sensitivity Characterization * PCT * Temp cycle * Temp/Humidity * High temp storage JEDEC Level 3 30 C/60% RH, 192 hours 121 C /100% RH/2 atm., 504 hours -65/+150 C, 1000 cycles 85 C/85% RH, 1000 hours 150 C, 1000 hours VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS250G Rev Date: 09'02 data sheet Cross-sections MQFP LEADFRAME MQFP Process Highlights Die thickness (max) 25 mil Solder plating 85/15 Sn/Pb Marking Pad/Laser Lead inspection Laser/Optical Pack/ship options Bar code, dry pack Test Services * Program generation/conversion * Product engineering * Wafer sort * 256 pin x 20 MHz test system available * -55 C to +165 C test available * Burn-in * Tape and reel services Shipping JEDEC outline CS-004 low profile tray * Bakable (125 C and 150 C) * Non-bakable MQFP w/Drop-in AI Heat Spreader Configuration Options: MQFP NOMINAL PACKAGE DIMENSIONS (mm) Body Size 10 x 10 10 x 10 14 x 14 14 x 14 14 x 14 14 x 20 14 x 20 28 x 28 28 x 28 28 x 28 32 x 32 32 x 32 40 x 40 Body Tkns 2.00 2.00 2.00 2.67 2.67 2.71 2.71 3.37 3.37 3.37 3.40 3.40 3.80 Lead Form 1.60 1.95 1.60 1.60 1.95 1.60 1.95 1.30 1.30 1.60 1.30 1.30 1.30 Standoff 0.15 0.15 0.15 0.15 0.15 0.33 0.23 0.13 0.33 0.33 0.38 0.32 0.43 Tip To Tip 13.2 13.9 17.2 17.2 17.9 17.2 x 23.2 17.9 x 23.9 30.6 30.6 31.2 34.6 34.6 42.6 Lead Count 44/52/64 44/52/64 52/64/80/100 52/64/80/100 52/64/80/100 64/80/100/128 64/80/100/128 208/256 120/128/144/160/208 120/128/144/160/208 240 240 304 JEDEC MS-022 MO-112 MS-022 MS-022 MO-112 MS-022 MO-112 MS-029 MS-029 MS-022 MS-029 MS-029 MS-029 Tray Matrix 6 x 16 6 x 16 6 x 14 6 x 14 6 x 14 6 x 11 6 x 11 3x8 3x8 3x8 3x8 3x8 2x6 Units Per Tray 96 96 84 84 84 66 66 24 24 24 24 24 12 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor's warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. |
Price & Availability of MQFP
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |